Name: MECHANIC 034 Main board layered Cutting Repair Tool Knife Kit Mobile Phone Maintenance Chip Remove Adhesive Glue Hand Grinding
SKU: mechanic 034
Availability: InStock

MECHANIC 034 Main board layered Cutting Repair Tool Knife Kit Mobile Phone Maintenance Chip Remove Adhesive Glue Hand Grinding

MECHANIC 034 Main board layered Cutting Repair Tool Knife Kit Mobile Phone Maintenance Chip Remove Adhesive Glue Hand Grinding - Image 2

MECHANIC 034 Main board layered Cutting Repair Tool Knife Kit Mobile Phone Maintenance Chip Remove Adhesive Glue Hand Grinding - Image 3

MECHANIC 034 Main board layered Cutting Repair Tool Knife Kit Mobile Phone Maintenance Chip Remove Adhesive Glue Hand Grinding

රු2,900.00

MECHANIC 034 Main board layered Cutting Repair Tool Knife Kit Mobile Phone Maintenance Chip Remove Adhesive Glue Hand Grinding
Blades Description :

IC/edge rubber removal: 21/16/22/23/24/25/26/29/30/34

CPU /motherboard layered: 01/02/03/04/11/18/19/28

Remove hard disk/baseband: 06/09/12/14/20/32/33

Shovel glue/remove glue: 05/07/08/10/27/13/15/17/30

Product Function :

Crescent Knife for iPhone A8 A9 A10 A11 A12 CPU BGA chip.

Crooked Knife Disassemble Cleaning Pry tool for mobile phone motherboard sealant glue.

UV Glue Cleaning Tool and crooked shovel Knife for Removing the motherboard sealant glue.

Solder Paste Scraping Knife for cell Phone BGA Repair and UV Glue Cleaning Tool.
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